Apple has placed orders for 36,000 TSMC SoIC wafers in 2026 and 60,000 wafers in 2027, far exceeding its Mac demand.
Morgan Stanley analyst Erik Woodring says the wafers will primarily fuel Apple’s 3nm AI ASIC, dubbed “Baltra,” for Private Cloud Compute.
Apple shifts from M‑series Ultra processors in PCC to a custom 3nm AI chip for better inference performance and cost efficiency.
AMD remains SoIC’s biggest customer with 42,000 wafers in 2026, expected to yield roughly 800,000 MI‑series AI GPUs.