Arihant Profile Extrusion – Next‑Generation Telecom Radome Roadmap
In a press release dated July 2026 and issued from Solapur, Maharashtra, Arihant Profile Extrusion outlined its long‑term research and development programme aimed at delivering next‑generation radome designs, precision profile extrusion techniques and advanced polymer engineering for the evolving telecom sector. The company positions the roadmap against the backdrop of global networks moving beyond 5G into 5G‑Advanced and the nascent 6G era, where Massive MIMO antenna systems demand larger, more sophisticated radome solutions that must retain dimensional stability, withstand harsh environmental exposure and allow radio‑frequency signals to pass with minimal loss.
Arihant highlighted that it has served more than ten industrial sectors, with telecom representing one of its most technically demanding domains. Over the past three decades the firm has refined its extrusion capabilities, now offering more than 35 specialised telecom radome profiles and supplying over 1.2 million metres of these profiles each year. Quality performance is consistently maintained below 500 parts per million (PPM). The company’s client base includes globally recognised antenna manufacturers such as CommScope, Rosenberger, Andrew Telecom, Amphenol and SPX, whose evolving product requirements shape Arihant’s engineering priorities.
Industry trends cited in the release include the drive to reduce antenna weight, improve structural efficiency, lower wind loading, enhance sustainability and simplify deployment without compromising RF performance. Anticipated future demands involve denser network architectures, increased uplink traffic, AI‑enabled services and the eventual transition to AI‑native 6G networks, all of which will place greater stress on physical infrastructure.
To meet these challenges, Arihant has instituted a long‑term research programme focused on:
- Lightweight alternatives to conventional fibre‑reinforced polymer (FRP) constructions;
- Next‑generation double‑wall radome architectures;
- Advanced engineering polymer systems;
- Recyclable material platforms; and
- Extrusion technologies capable of supporting increasingly sophisticated antenna designs.
Supporting these initiatives is the company’s new Industry 4.0 manufacturing campus in Solapur, commissioned with an annual production capacity of 6,000 metric tonnes spread over 170,000 square feet of facility space. The campus features end‑to‑end automation covering raw‑material handling, intelligent compounding, extrusion, quality inspection, packaging and dispatch, thereby delivering the consistency required for high‑precision telecom applications while retaining flexibility to scale future material innovations.
"Every kilogram removed from an antenna assembly reduces tower loading. Every improvement in structural efficiency simplifies deployment. Every advancement in manufacturing precision contributes to long‑term network reliability," said Anish Shah, Director – Engineering at Arihant Profile Extrusion. "Those are no longer manufacturing objectives; they are engineering requirements shaping the future of telecommunications. At Arihant, our research is focused on advancing radome design, polymer engineering and precision extrusion technologies that help customers build lighter, stronger and more efficient network infrastructure."
The release concludes by reaffirming Arihant’s commitment to combine three decades of extrusion expertise with continued investment in polymer science, product design and advanced manufacturing to help shape the next generation of telecom infrastructure, one engineered profile at a time.
For further information, contact info@arihantprofile.in.