CADFEM APAC and SilTerra Malaysia Sign MoU to Accelerate Semiconductor Innovation

On June 12, 2026, CADFEM APAC, a leading provider of engineering simulation and digital engineering solutions, announced the signing of a Memorandum of Understanding (MoU) with SilTerra Malaysia Sdn. Bhd., one of Malaysia’s premier semiconductor foundries and fabless design service providers. The announcement was issued jointly from Hyderabad, India and Seberang Perai, Malaysia via PRNewswire.

The semiconductor industry faces mounting pressure to deliver more capable technologies while simultaneously reducing development time, cost, and risk. In response, the MoU establishes a strategic framework aimed at accelerating innovation through simulation‑led development, tighter design‑process alignment, and advanced digital engineering methodologies.

Collaboration Scope

  • Technical Expertise Integration: CADFEM APAC will contribute its multiphysics simulation, digital engineering, and predictive development capabilities, while SilTerra will supply deep knowledge of semiconductor manufacturing, process development, and fabrication technologies.
  • Design‑Technology Co‑Optimization (DTCO) & System‑Technology Co‑Optimization (STCO): Both parties will develop unified digital environments that integrate device, process, and design domains, enabling earlier technology exploration, faster design validation, and improved correlation between simulation models and manufactured devices.
  • Predictive Engineering Environments: CADFEM will model device physics, material behaviour, thermal‑electrical interactions, variability, and system‑level performance. SilTerra will provide process insights, fabrication expertise, and characterization data to ensure alignment between virtual models and manufacturing realities.
  • AI‑Driven Enhancements: The partnership will explore Agentic AI applications, including natural language processing (NLP), Retrieval‑Augmented Generation (RAG), AI‑assisted electronic design automation (EDA) environments, and PDK integrations, to streamline documentation, improve cross‑functional collaboration, and accelerate the transition from optical circuit concepts to manufacturable System‑on‑Chips (SoCs) and Photonic Integrated Circuits (PICs).
  • Reliability‑Focused Engineering: Joint work will address reliability concerns for automotive, industrial electronics, and other high‑dependability applications, emphasizing thermal, electrical, and environmental effects on semiconductor performance.
  • Optical Interconnect Development: SilTerra is advancing next‑generation optical interconnect technologies on unified silicon architectures to meet growing data‑transfer and power‑dissipation challenges.

Executive Commentary

Beng Joo Thung, Senior Vice President of SilTerra Malaysia, stated that the future of semiconductor advancement hinges on the ability to connect design, process development, and manufacturing within a unified engineering framework, and that the collaboration will accelerate innovation, improve development efficiency, and strengthen market confidence.

Dr.-Ing. Madhukar Chatiri, CEO of CADFEM APAC, emphasized that rapid translation of ideas into manufacturable technologies is increasingly critical, and that the combined predictive engineering and manufacturing knowledge will provide a stronger foundation for faster development, better design decisions, and reduced technology risk.

Broader Impact

Beyond technology development, the MoU aims to showcase practical engineering advancements and contribute to the growth of the regional semiconductor ecosystem. The partnership is positioned to support the evolving needs of the global semiconductor industry through simulation‑driven engineering, stronger design‑manufacturing alignment, and accelerated technology development.

Media Contact: Prachi Mardia, marketing@cadfem.in

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