Announcement

Caresoft Global and Delhi Research Implementation and Innovation (DRIIV) signed a Memorandum of Understanding on 17 August 2026 in New Delhi to collaborate on talent development and bridge the engineering skill gap in India. The MoU establishes a structured industry‑engagement model that will bring global manufacturing and technology intelligence into the Indian engineering, manufacturing, and education ecosystem.

Partnership Structure

DRIIV operates under the Office of the Principal Scientific Adviser to the Government of India and was created on the recommendation of the Prime Minister’s Science, Technology and Innovation Advisory Council (PM‑STIAC). Adroit Technologies Innovative Solutions Pvt. Ltd. has been appointed as the Implementation Partner, responsible for managing the operations of the planned Centers of Excellence, including faculty enablement, onboarding, and delivery across mechanical, automotive, electrical and electronics, manufacturing, industrial engineering, computer‑science/IT, and AI disciplines.

Strategic Context

India is among the world’s fastest‑growing manufacturing economies, transitioning toward higher‑value products and globally integrated supply chains. The industry is rapidly shifting to Electric Vehicles (EVs), Software Defined Vehicles (SDVs), and electronics‑intensive product architectures. A persistent challenge to long‑term competitiveness is developing engineers who have real exposure to global manufacturing practices and technology know‑how. While Indian institutions produce graduates with strong theoretical foundations, few have studied how world‑class products are designed, benchmarked, engineered, and improved throughout their lifecycle.

Program Details

The collaboration will drive talent upskilling by deploying Centers of Excellence across the country and running focused, multidisciplinary development programmes in emerging technology sectors. These sectors include Software Defined Vehicles, Electric Vehicles and new‑energy mobility, high‑voltage battery systems, hybrid systems, automotive electronics, semiconductors, Artificial Intelligence, and Big Data analytics. The Centres will provide structured, hands‑on exposure to contemporary industrial practice, preparing students for the evolving expectations of manufacturing and engineering employers.

Iceberg Platform

At the core of the initiative is Iceberg, Caresoft Global’s engineering benchmarking and technology‑intelligence platform. Iceberg showcases how leading OEMs and suppliers make decisions on design, performance, manufacturability, quality, and cost. Through Iceberg, Indian engineering and manufacturing ecosystems will be able to study how products are engineered, benchmarked, and continuously improved using real manufacturing intelligence, covering EVs, SDV architectures, and the associated electronics and systems.

Quotes

Prof. Ambuj D. Sagar, Acting CEO of DRIIV, stated that the collaboration addresses a national priority, noting that “India’s manufacturing ambitions will increasingly be shaped by the strength of its engineering capabilities.” Krishna Kumar Gaur, Head of Institutional Relations at DRIIV, added that the framework enables academia and industry to complement engineering education with exposure to contemporary industrial practice. Prideep Subramaniam, Vice‑President, APAC, Caresoft Global, emphasized that “Every product tells an engineering story,” and that Iceberg will make this story accessible to Indian institutions.

About Caresoft Global

Caresoft Global is a world leader in automotive benchmarking and cost‑reduction products and programmes. It operates worldwide with more than eight technology centres and has identified over US$3.5 billion in cost‑reduction opportunities for the global automotive industry. Through this MoU, Caresoft is extending its engineering intelligence to the academic sector in India.

Contact

Marketing and Communications: marcom@caresoftglobal.com

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