Partnership Details: Covalent announced a partnership with Oxford Instruments to expand semiconductor characterization services using wafer‑level Raman and photoluminescence workflows.
Technology Integration: Covalent integrated Oxford Instruments’ WITec360™ Raman system, equipped with dual 355 nm and 532 nm laser excitation, enabling surface‑sensitive photoluminescence and high‑resolution Raman imaging in a single workflow.
Capability Scope: The system can handle wafers up to 300 mm in diameter and perform wafer‑level mapping of crystallinity, doping, stress, and defects within one integrated workflow.
Target Materials: The collaboration focuses on silicon carbide (SiC) and gallium nitride (GaN) as these compound semiconductors move toward high‑volume production.
Customer Benefits: According to Covalent CEO Craig Hunter, the solution supports yield improvement, process control, and failure analysis at wafer scale.
Oxford Instruments Viewpoint: Vahan Tchakerian, Senior Vice President of Sales & Applications at Oxford Instruments, said the partnership helps bridge the gap from R&D to high‑volume manufacturing, accelerating development and production outcomes.
