CXMT Begins Mass Production of LPDDR6 DRAM Chips and Secures Xiaomi Supply Deal
China’s ChangXin Memory Technologies (CXMT) announced that it has started mass production of its latest LPDDR6 dynamic random‑access memory (DRAM) chips. The chips will be integrated into Xiaomi’s forthcoming flagship foldable smartphone, the Xiaomi 18 Fold, which the company confirmed via its official Weibo account and is slated for market launch in September. Xiaomi also disclosed that the device will be powered by its internally developed 3‑nanometre Xring O3 processor, which is designed to support LPDDR6 memory.
Financial Performance Highlights
In the same week, CXMT reported a sharp swing to profitability in its first‑half earnings, the first such release since the company went public. Revenue surged 874 % year‑on‑year to 150.3 billion yuan (approximately $22.36 billion). The company highlighted that it has already shipped LPDDR6 samples to customers for use in mobile devices, servers and smart‑car applications.
Competitive Positioning
The LPDDR6 product represents CXMT’s most advanced mobile‑device DRAM offering and narrows the technology gap with global memory leaders Samsung Electronics and SK Hynix, positioning the Chinese firm more competitively in the high‑performance mobile memory market.
Legal Action Against U.S. Department of Defense
Separately, CXMT filed a lawsuit on Friday against the U.S. Department of Defense, challenging its inclusion on a U.S. government list that identifies companies linked to China’s military. The filing underscores ongoing U.S.–China tensions over advanced semiconductor technology and the broader restrictions aimed at limiting China’s access to sophisticated chips and manufacturing equipment.