Event Type: Conference call focused on semiconductor strategic financing transaction and growth roadmap
Event Date: Held on 26 May 2026
Purpose: Discussion of semiconductor strategic financing transaction and growth roadmap
Management Participants: Not specified in this disclosure
Recording Availability: The recording of the conference call is available on the Company's website at cyient.com/hubfs/2026/Investors/Financial Information/Key Financials/Cyient-Semiconductor-Conference-Call-Q1FY27.mp3
UPSI Statement: The disclosure does not contain any statement regarding unpublished price sensitive information
Additional Notes Section
Financial Data: No financial data or performance metrics were disclosed in this announcement
Attachments: No attachments were mentioned in this disclosure
Compliance: Standard regulatory filing to inform exchanges about availability of investor conference call recording
