Press Release Overview

EPG, a global provider of prefabricated modular data‑center infrastructure, presented its latest AI data‑center solutions at Data Centre World Asia (DCWA) 2026 in Singapore on September 29‑30. The event highlighted EPG’s end‑to‑end capabilities across modular infrastructure and high‑efficiency cooling for AI data centres (AIDCs).

Product Portfolio Introduced

  • AI Core: A prefabricated, modular AI infrastructure solution that integrates standardized power, cooling and other critical modules to accelerate deployment and enable flexible expansion as compute requirements grow.
  • Edge POD: An all‑in‑one edge data‑center offering designed for distributed computing environments where power availability and rapid deployment are critical. It supports 1–10 MW applications, delivers low‑latency computing and provides distributed redundancy.
  • AeroLev 1850: Launched globally in partnership with MagPro, this 1.85 MW‑class, air‑cooled magnetic‑bearing chiller is built for next‑generation AI data centres operating in water‑scarce, high‑ambient conditions. It delivers chilled‑water outlet temperatures up to 45 °C, features a cooling‑tower‑free architecture, oil‑free magnetic‑levitation technology and intelligent controls to reduce water consumption while maintaining reliability.

Technical and Operational Details

  • The AeroLev 1850’s magnetic‑bearing technology eliminates the need for oil lubrication, and its air‑cooled design removes reliance on traditional cooling towers.
  • MagPro’s production base exceeds 6,000 sq m and includes two air‑cooled laboratories capable of testing units up to 2,000 kW.
  • EPG operates R&D centres in Singapore, Malaysia and Shanghai, supported by six advanced manufacturing hubs located in Malaysia and China.
  • The company employs more than 1,600 staff, including nearly 300 researchers and engineers within its R&D and technical teams.

Leadership Commentary and Panel Discussions

  • Johnny Zhang, Chief Operating Officer, opened the Critical Infrastructure Theatre, emphasizing that AI is driving higher power density, faster deployment cycles and the need for more efficient cooling. He later moderated a panel on data‑center resilience and digital infrastructure, bringing together experts from design, cloud, AI infrastructure and cooling technology.
  • Enso Li, Chief Technology Officer, presented the AI Core solution at the Energy Security & Efficiency Theatre, illustrating how factory‑prefabricated modules can shorten deployment timelines.
  • Alick Wan, Founder and Chairman of EPG, stated that the company’s focus extends beyond individual technological breakthroughs, aiming to combine modular, standardized solutions with global delivery capabilities to help customers deploy and scale computing infrastructure efficiently across markets.

Partnerships and Agreements

EPG signed cooperation agreements with several international industry partners covering AI data‑center planning, construction and delivery. These collaborations are intended to broaden EPG’s ecosystem across the Asia‑Pacific region and expand its presence in global markets.

Joint Venture Details

MagPro, established in May 2026, is a joint venture between CIGU Technology Corp. Ltd. and EPG Data Technology (Shanghai) Co., Ltd. It focuses on research, development and production of energy‑efficient cooling and air‑conditioning systems for AI data centres, cloud and hyperscale environments.

Outlook

EPG indicated that it will continue evolving its modular and cooling solutions to meet the changing demands of the data‑center industry, leveraging its global delivery network and partnerships to support the next generation of digital growth.