Press Release Overview
On 8 October 2026, Fibocom Ltd., a global provider of wireless communication modules and AI solutions, announced a collaboration with Indian IoT original design manufacturer Grid‑OS Ltd. The partnership was highlighted at the India Mobile Congress (IMC) 2026 in New Delhi.
Product Portfolio
The joint offering includes a Payment Soundbox that incorporates Fibocom’s LE270 LTE Cat 1 bis module, delivering stable 4G connectivity for real‑time payment information transmission. The LE270’s optimized connected‑mode operation and DRX standby mode enable approximately 7–8 days of battery life when powered by a 2000 mAh cell. In addition, Grid‑OS displayed two 4G Vehicle Trackers built around Fibocom’s LE250 series LTE Cat 1 bis modules. The LE250 provides LTE connectivity together with GPS/BeiDou positioning, supports OpenCPU and DFOTA for streamlined development and over‑the‑air updates, and is intended for continuous vehicle location and operational data reporting.
Market Context
National Payments Corporation of India (NPCI) data cited in the release indicate that UPI transactions reached 24.51 billion in August 2026, underscoring the rapid growth of digital payments and the expanding demand for reliable, low‑power IoT connectivity in applications such as vehicle tracking.
Executive Comments
Raghav Gautam, Founder of Grid‑OS, stated that Fibocom’s broad wireless portfolio offers the flexibility to select suitable solutions for diverse IoT product requirements and that the combined capabilities from product development to mass manufacturing lay a strong foundation for extending the collaboration to additional applications. Ronald Chan, Vice President of APAC Sales at Fibocom, emphasized India’s importance as an IoT market and noted that the expanded partnership—from the payment soundbox to vehicle trackers—demonstrates how Fibocom’s diversified portfolio can support local partners and accelerate commercial deployment at scale.
About Fibocom
Founded in 1999, Fibocom develops cellular, AI, automotive and GNSS modules, AI toolchains, global connectivity and cloud services that enable connected and intelligent applications worldwide.