India's First 3D Semiconductor Packaging Unit Groundbreaking in Odisha

• 3D Glass Solutions invests ₹1,943.53 crore in India's first advanced 3D semiconductor packaging unit in Bhubaneswar.
• The facility targets annual production of 70,000 glass panels, 50 million assembled units, and 13,000 advanced 3DHI modules by 2030.
• Project receives ₹799 crore Central fiscal support and ₹399.5 crore State support under India Semiconductor Mission.
• Unit will serve AI, 5G/6G communications, defence electronics, and data center sectors with production starting August 2028.