Extracted Data Points

  • Memorandum of Understanding signed between Government of Odisha, Intel Corporation and 3DGS Inc. USA
  • Estimated investment of approximately USD 3.3 billion
  • Project represents one of the largest high-technology manufacturing investments in India
  • Facility to be located in Bhubaneswar–Khurda region of Odisha
  • Implementation planned over 5-6 year period in phases
  • Expected to generate more than 1,800 direct high-skilled employment opportunities
  • Significant indirect employment expected across broader manufacturing and technology ecosystem
  • Facility will focus on advanced packaging glass core substrates and high-density interconnect substrates
  • Intel will provide technology know-how and process expertise
  • Project builds on efforts under India Semiconductor Mission
  • Initiative aims to strengthen domestic manufacturing, design ecosystem and supply chain capabilities
  • Expected to contribute to capability development, ecosystem growth and export-oriented manufacturing
  • Project positions Odisha among emerging global centers for semiconductor manufacturing
  • Other semiconductor firms mentioned: Applied Materials Inc., Lam Research, Tokyo Electron Ltd., Merck Electronics
  • Mention of MoU between Tata Electronics and Dutch multinational ASML