izmo & IIT Madras Launch ₹99.94 Cr Phase II

iz​mo Limited (NSE: IZMO, BSE: 532341) announced that its semiconductor subsidiary, izmo Microsystems Pvt. Ltd., has entered into a Memorandum of Understanding with the Indian Institute of Technology Madras (IIT Madras) to commence Phase II of the Centre for Programmable Photonic Integrated Circuits and Systems (CPPICS) programme, titled Silicon Photonics Enabled Cutting‑edge Technology Research and Applications (SPECTRA). The programme has been sanctioned by the Ministry of Electronics and Information Technology (MeitY) with a total outlay of ₹99.94 crore, of which ₹97.54 crore is contributed by MeitY and ₹2.40 crore is provided by izmo Microsystems in cash and in‑kind support.

The five‑year initiative is designed to move silicon‑photonic technologies from research to commercially deployable products. It targets four application domains: high‑speed optical transceivers for data‑centres, microwave photonics for advanced wireless communications, quantum photonics, and photonic computing for AI workloads. Specific technical goals include a 1.6 Tbps silicon‑photonic transceiver engine operating at 1550 nm, microwave photonic engines operating beyond 50 GHz, integrated quantum‑random‑number‑generator/quantum‑key‑distribution (QRNG/QKD) systems, and photonic processors for AI. The programme also plans to deliver a silicon‑photonic Process Design Kit (PDK) containing more than 100 IP blocks for 200 mm wafer platforms.

iz​mo Microsystems will drive the packaging and industrialisation aspects of the programme. Its responsibilities progress from defining packaging architecture and co‑packaged optics (CPO) interface to photonic‑electronic integration (PIC‑EIC), precision fiber alignment and attachment, production‑grade packaging, process optimisation, prototype assembly and reliability validation. The ultimate objective is to establish a certified CPO design‑rule and service capability, creating a clear pathway from foundry‑fabricated photonic chips through packaging, qualification and system‑level deployment.

The press release cites LightCounting data indicating that global sales of optical transceivers and related products reached $26.8 billion in 2025, a 74 % year‑on‑year increase, with the market projected at $40 billion in 2026 and silicon‑photonic transceivers expected to represent more than half of that market. The market for optical chips used in transceivers, active optical cables and co‑packaged optics is estimated to grow from ~$4 billion in 2025 to $15 billion by 2031.

Dinanath Soni, Director of izmo Microsystems, stated that silicon photonics is becoming critical for the next generation of AI and data‑centre infrastructure as network speeds shift from 400 G and 800 G toward 1.6 T and beyond, emphasizing that the challenge now lies in reliable packaging and integration rather than chip design alone.

Phase II builds on Phase I, which achieved more than 95 % of its planned milestones and generated research, IP and prototypes across programmable photonics, microwave photonics and quantum technologies. Phase II expands the focus toward technology translation, industrialisation and commercialisation, with anticipated applications in data centres, telecommunications, defence, quantum technologies and advanced computing.

About izmo Microsystems Pvt. Ltd.: it is an advanced semiconductor packaging and manufacturing company based in Bengaluru, offering design, development, prototyping, qualification and manufacturing services across advanced IC packaging, system‑in‑package, RF and microwave packaging, and silicon‑photonic and optical packaging.

Contact: izmo Limited, Investor Relations, 177/2C, Bilekahalli Industrial Area, Bannerghatta Road, Bangalore 560076, CIN: L72200KA1995PLC018734, Email: investors@izmoltd.com.

Forward‑looking statements disclaimer as per the release.