Regulatory Filing Details

Program Details

  • Program Name: Centre for Programmable Photonic Integrated Circuits and Systems (CPPICS) Phase II - Silicon Photonics Enabled Cutting-edge Technology Research and Applications (SPECTRA)
  • Sanctioning Authority: Ministry of Electronics and Information Technology (MeitY), Government of India
  • Total Project Outlay: ₹99.94 crore
  • Funding Breakdown: MeitY contribution of ₹97.54 crore and izmo Microsystems commitment of ₹2.40 crore (cash and in-kind)
  • Program Duration: Five-year program
  • Effective Date: Phase II entry announced October 07, 2026

Technological Objectives

The program aims to advance silicon photonics technologies from research towards commercially deployable products, covering:

  • Photonic integrated circuit design
  • Fabrication
  • Characterization
  • Advanced packaging
  • Testing
  • System integration

Specific technology targets include:

  • 1.6 Tbps silicon photonics transceiver engine operating at 1550 nm for high-performance computing and data-center routing
  • Microwave photonic engines operating beyond 50 GHz
  • Integrated QRNG/QKD systems (quantum random number generation/quantum key distribution)
  • Photonic processors for AI workloads
  • Silicon photonics Process Design Kit incorporating more than 100 IP blocks for 200 mm wafer platforms

Application Areas

  • High-speed optical transceivers for data centers
  • Microwave photonics for advanced wireless communications
  • Quantum photonics
  • Photonic computing for AI

Market Context

The disclosure references LightCounting market data:

  • Global optical transceiver and related products sales reached $26.8 billion in 2025 (74% YoY growth)
  • Estimated optical transceiver market at approximately $40 billion in 2026
  • Silicon-photonics-based transceivers expected to represent more than half of the market for the first time in 2026
  • Market for optical chips estimated to grow from approximately $4 billion in 2025 to $15 billion by 2031

izmo Microsystems' Role

  • Drive packaging and industrialization efforts
  • Develop volume photonics packaging ecosystem
  • Progress from packaging architecture and CPO interface definition to PIC-EIC co-integration
  • Handle fiber alignment and attachment, production-grade packaging, process optimization
  • Conduct prototype assembly and reliability validation
  • Target certified co-packaged optics design rule and service capability

Building on Previous Phase

  • CPPICS Phase I achieved more than 95% of its planned milestones
  • Generated research, IP and prototypes across programmable photonics, microwave photonics and quantum technologies
  • Phase II expands toward technology translation, industrialization and commercialization

Strategic Intent

Through the collaboration, izmo Microsystems intends to:

  • Strengthen advanced photonic packaging capabilities
  • Participate in emerging global market for silicon photonics
  • Address high-speed optical interconnects and co-packaged optics for AI and high-performance computing infrastructure

Forward-Looking Statements

The document contains cautionary language regarding forward-looking statements, noting they are subject to risks and uncertainties including regulatory changes, local political or economic developments, and other factors that could cause actual results to differ materially from those contemplated.