Announcement
IZMO Microsystems Pvt. Ltd., the semiconductor packaging subsidiary of IZMO Limited (NSE: IZMO, BSE: 532341), announced the development of an indigenous high‑frequency RF Quad Flat No‑Lead (QFN) package capable of operating at frequencies up to 40 GHz. The package has been designed, developed and manufactured entirely in India for a customer building high‑frequency RF modules for defence and secure wireless communication applications.
Technical Highlights
The package employs a proprietary architecture with optimized trace geometry and precise die positioning. Wire bond lengths are approximately 0.3 mm, and a precision air cavity surrounds the die, together minimizing parasitic effects that typically limit performance at microwave frequencies. This design enables reliable operation of semiconductor devices at frequencies as high as 40 GHz, addressing the demanding requirements of radar, electronic warfare, secure communications, aerospace, satellite communications and advanced wireless systems.
Production & Scale
Following successful assembly and electrical validation, izmo Microsystems has commenced production shipments. Manufacturing processes have been established to support scale‑up, and the company states it has the capability to increase output as demand grows.
Strategic Context
The development aligns with India’s indigenization mandate and record defence budgets, which are driving demand for advanced domestic electronics and semiconductor capabilities. By creating critical RF packaging technology within the country, the initiative enhances supply‑chain resilience for strategic applications. The announcement comes as the Government of India has approved the Semicon 2.0 programme, allocating an outlay of ₹1,27,500 crore to strengthen the semiconductor ecosystem, with advanced packaging identified as one of the six pillars of the initiative.
Leadership Quote
Dinanath Soni, Director of izmo Microsystems Pvt. Ltd., said: “High‑frequency RF devices place very demanding requirements on semiconductor packaging, and at 40 GHz the package has to be engineered as an integral part of the RF system. We developed this package around the specific electrical and application requirements of the device and have taken it through design, fabrication, assembly and validation into production. Production shipments have now commenced, and we have the manufacturing capability to scale as requirements grow. We see significant opportunities for advanced RF packaging in defence, secure communications, aerospace and other high‑frequency applications as India builds deeper domestic capabilities in strategic electronics and semiconductor manufacturing. The increased focus on advanced packaging under Semicon 2.0 should provide further impetus to the development of this ecosystem in India.”
Company Background
Izmo Microsystems Pvt. Ltd. is an advanced semiconductor packaging and electronics manufacturing company based in Bengaluru, India. It focuses on System‑in‑Package, advanced IC packaging and high‑reliability electronics for defence and aerospace, telecommunications, industrial electronics, automotive, medical electronics, optical communications and other advanced technology markets. For further information, visit www.izmomicro.com or www.izmoltd.com.
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