Lexar’s 30th‑Anniversary Product Reveal at IFA 2026
Lexar marked its three‑decade milestone by launching the Muse Ultra‑Slim Portable SSD during the IFA 2026 exhibition in Berlin, held from September 4 to September 8 at Messe Berlin, Level 1, Hall 20, Stand 101. The company highlighted its evolution from memory cards to advanced AI‑grade storage solutions.
Muse Ultra‑Slim Portable SSD – Core Specifications
The Muse is presented as the world’s thinnest portable SSD, with a maximum thickness of 3.8 mm that tapers to a 1 mm edge. It is built from a single‑piece precision‑machined metal enclosure, minimizing seams and visual interruptions. Internally, a custom ultra‑thin PCB, high‑density NAND stacking, and an integrated structure maximize space without sacrificing performance. The drive employs Lexar’s proprietary PogoPin magnetic data connection, complemented by a spring‑loaded‑pin interface and N52‑grade neodymium magnets in both the data connector and a magnetic carry sleeve. The supplied SnapLink magnetic cable attaches to the PogoPin, creating a clean, cable‑free experience.
Performance-wise, the Muse delivers sequential read speeds of up to 1,050 MB/s and sequential write speeds of up to 1,000 MB/s. It is available in 512 GB and 1 TB capacities, with shipments slated to begin in Q4 2026. Compatibility includes iPhone models from the iPhone 15 series onward (requiring USB‑C), iPad, Mac, and any USB‑C device. On supported iPhone models, the Muse can record Apple ProRes 4K video at up to 120 fps directly to the drive. The magnetic sleeve also allows the SSD to attach securely to the back of compatible MagSafe iPhone models.
AI Storage Core Technologies
Beyond the consumer‑focused Muse, Lexar showcased its AI Storage Core, featuring next‑generation AI‑grade Gen5 SSD and Storage Stick concepts. Both devices achieve bandwidths of up to 11 GB/s, targeting compact AI hardware that demands large local model storage, rapid model switching, and low‑latency data access within constrained power and thermal envelopes. The architecture is built around Longsys’ self‑developed Gen5 controller, the Storage Processing Unit (SPU), fabricated on a 5 nm process and operating without DRAM. The SPU improves supply‑chain stability while delivering high‑performance AI storage.
Lexar’s Luma Bridge technology adds intelligent workload scheduling, predictive prefetch, and optimized cache management, enabling efficient handling of large Mixture‑of‑Experts models, expanded KV cache, and reduced I/O latency. These innovations collectively lower DRAM capacity requirements by approximately 40 % for local AI workloads.
Expansion into Commercial PCs and Electric Vehicles
Lexar announced an expanded portfolio for OEMs, commercial PC builders, and specialised applications. The company now offers client SSDs across PCIe Gen3 and Gen4 interfaces, providing a range of performance, capacity, and cost options to suit diverse device partners.
Addressing the growing storage needs of electric‑vehicle (EV) owners, Lexar introduced a dedicated Dashcam USB Flash Drive series. Designed for continuous loop recording, dashcam, and Sentry‑Mode‑style functionalities, the drives feature high‑endurance firmware, broad EV compatibility, a low‑profile form factor, and reliable operation across demanding temperature ranges, offering a purpose‑built alternative to conventional USB sticks.
Company Footprint and Invitation
Founded in California in 1996, Lexar now operates through more than 100,000 sales channels on six continents, serving over 100 million users in more than 70 countries. Its portfolio spans memory cards, SSDs, DRAM, and mobile storage solutions.
Media, partners, creators, and industry visitors were invited to explore these innovations at the IFA 2026 showcase from September 4‑8, 2026.