Mold-Tek Packaging Board to Consider Interim Dividend

Mold-Tek Packaging intimates exchanges of a board meeting on April 20, 2026, to consider declaring a first interim dividend for FY25-26.
The company has fixed a record date of April 24, 2026, to determine shareholder eligibility for the dividend, if declared.
The trading window for the company remains closed from April 1, 2026, until 48 hours after the declaration of Q4 and FY26 results.