Pursuant to SEBI (Listing Obligations and Disclosure Requirements) Regulations, 2015, Mold-Tek Packaging Limited intimates that company officials will be attending an investor conference organized by Nirmal Bang Institutional Equities.
The meeting details are as follows:
- Date: August 10, 2026
- Organizer: Nirmal Bang Institutional Equities
- Venue: Mumbai
- Mode: 1x1 / Group meetings
- Type: Semi-Annual Investor Conference
The company confirms that participation was confirmed on August 07, 2026 (today), and accordingly this intimation is being provided at shorter notice. The company will refer only to publicly available documents during the discussions and explicitly states that no unpublished price sensitive information (UPSI) will be discussed during these interactions.
The schedule of the meeting is subject to change due to exigencies on the part of either the organizer or the company.
The disclosure is signed by Harshita Suresh Chandnani, Company Secretary and Compliance Officer, and was digitally signed on August 07, 2026 at 14:34:48 IST.