Paras Defence and Space Technologies Limited has filed a regulatory disclosure under SEBI Listing Regulation 30 regarding its subsidiary, Paras Semiconductors Private Limited. The subsidiary has signed a Memorandum of Understanding (MoU) with the Department of Science and Technology acting through MP State Electronics Development Corporation (MPSeDC).
The MoU establishes a collaboration between Paras Semiconductors and MPSeDC to integrate their respective expertise and resources for establishing a greenfield advanced IC packaging OSAT (Outsourced Semiconductor Assembly and Test) facility in Madhya Pradesh.
Key Project Details
- Paras Semiconductors will establish the greenfield advanced IC packaging OSAT facility in Indore-Ujjain, Madhya Pradesh
- The proposed investment for the facility is approximately ₹6,200 Crores
- The facility will undertake advanced packaging operations including:
- 3D heterogeneous integration
- 2.5D/3D advanced packaging
- Hybrid bonding
- Ultra-high-density fan-out packaging
- Chiplet integration
- Wafer bumping
- Flip-chip assembly
- Testing and reliability operations