TSMC shares rose 5% to a record NT$2,180 after unveiling next‑generation chip technology and U.S. expansion plans.
The company introduced the A13 node, a ~1.3 nm process delivering ~6% higher transistor density and better efficiency versus A14.
TSMC announced an advanced chip‑packaging plant in Arizona slated for 2029, supporting CoWoS and 3D integration for AI and HPC chips.