SEMICON India 2026, held from September 17-19 at Yashobhoomi in New Delhi, served as a comprehensive showcase of India's growing semiconductor capabilities across the entire value chain. The fifth edition of the event, themed "Silicon to Systems: Building the Ecosystem", brought together over 600 exhibiting companies from various countries along with industry leaders, policymakers, investors, academia, and start-ups.
The exhibition highlighted India's expansion beyond chip design into manufacturing, packaging, research, materials, talent development, and system-level applications. Key demonstrations included C-DAC's AUM HPC-AI Processor and RUDRA-AUM compute node for high-performance computing, alongside indigenous 64-bit RISC-V processor technology. Several Indian companies showcased specific applications: Vervesemi Microelectronics displayed semiconductor solutions for motor control, energy meters, and data acquisition applications targeting consumer appliances, electric mobility, and drones; InCore Semiconductors featured indigenous RISC-V processor IPs and SoC design automation tools proven across technology nodes from 180 nm to 16 nm; and Aheesa Technology demonstrated an indigenous internet connectivity device delivering speeds up to 1 Gbps using fully Indian technology stack.
The AI and surveillance segment featured Netrasemi's indigenously designed AI SoC for CCTV Surveillance in the 12 nm process node, integrating AI/ML accelerators for applications in secure surveillance, smart sensors, robotics, drones, and mobility. The event coincided with significant policy developments, including the Union Cabinet's approval of Semicon 2.0 in July 2026 with an outlay of ₹1,27,500 crore, focusing on six strategic pillars: design, machines and materials, more fabs, advanced packaging, research and development, and talent development.
Under the Semicon India Programme, 12 semiconductor projects have been approved across six states with investment commitments exceeding ₹1,64,000 crore, with three facilities already commencing commercial production. The Design Linked Incentive (DLI) Scheme has supported domestic chip-design projects across video surveillance, drone detection, energy meters, microprocessors, satellite communications, broadband, and IoT SoCs. The Chips to Startup (C2S) Programme has onboarded over 100,000 engineers from more than 500 organizations, including 400 academic institutions and 100 start-ups, through the ChipIN Centre. These participants have developed more than 300 chip designs for fabrication at foundries in India and abroad, recording over 4 crore hours of chip-design tool usage, creating the largest centralized chip-design user base at the ChipIN Centre.