SEMICON India 2026, the fifth edition of India's flagship semiconductor conference, concluded successfully at Yashobhoomi, New Delhi from September 17-19, 2026. The event recorded 51,656 total registrations and approximately 40,000 cumulative footfall, featuring over 600 exhibitors including around 300 international companies from 52 countries. Six Country Pavilions (Japan, South Korea, Malaysia, Netherlands, Singapore, Sweden) and 12 State Pavilions participated alongside a Startup Pavilion and Workforce Development Zone.
Prime Minister Narendra Modi inaugurated the event and highlighted India's transition from policy discussions to commercial semiconductor production. He virtually inaugurated commercial production lines at CDIL Semiconductor in Mohali and Suchi Semicon in Surat, bringing the number of operational commercial semiconductor units among the 12 projects approved under Semicon 1.0 to five. The Prime Minister outlined Semicon 2.0 with an outlay of ₹1,27,500 crore structured around six pillars: design, machines and materials, new fabs, advanced packaging, research, and talent development.
The three-day event resulted in 56 MoUs, announcements, and strategic initiatives spanning semiconductor design, fabrication, advanced packaging, equipment and materials, power electronics, Artificial Intelligence, High-Performance Computing, R&D, logistics, technology commercialization, and workforce development. Day 2 focused on ecosystem development with Union Minister Ashwini Vaishnaw detailing the implementation approach for Semicon 2.0. Discussions covered resilient supply chains, AI-enabled chip design, advanced packaging, indigenous R&D, and workforce development.
The concluding day emphasized technological capability, ease of doing business, sustainability, and deep-tech startups. The Digital India RISC-V Grand Challenge attracted 1,236 teams with 5,045 participants, with awards presented for solutions using indigenous VEGA and SHAKTI processor-based System-on-Chips. Three hackathons organized by KLA, Synopsys, and Lam Research in partnership with CeNSE-IISc received over 3,800 team registrations from more than 900 colleges.
International engagement featured six Country Roundtables: India-USA (180 participants), India-Japan (200 participants), India-Singapore (142 participants), India-Europe (139 participants), India-South Korea (115 participants), and India-Malaysia (150 participants). These discussions focused on commercial partnerships, technology collaboration, equipment and materials, resilient supply chains, and R&D cooperation, particularly leveraging Malaysia's back-end semiconductor capabilities and India's strengths in design and manufacturing.